SE95_7
?NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 2 September 2009
23 of 27
NXP Semiconductors
SE95
Ultra high accuracy digital temperature sensor and thermal watchdog
16.4 Reow soldering
Key characteristics in reow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see
Figure
21) than a SnPb process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
T
ab
le
19 and
20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see
Figure
21.
Table 19. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
e 350
< 2.5
235
220
e 2.5
220
220
Table 20. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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